SEI LASER PackMaster CW
Laser flexibility for easy-open, window packaging, easy-ventilation, easy-breath in flexible packaging. System is designed for laser cutting, laser scoring, macro- and micro-perforation of single- or multi-layer flexible films.
Compatible materials include: paper, PE, PET, PP, nylon, PTFE and laminated films. Production markets for food & beverage, pet food, personal care and grocery products. Roll width of up to 1800 mm and process speed of up to 400 m/min.
It can be easily integrated into existing production lines. Very high precision in the material removal and macro/micro-perforation, repeat-ability of the process over time. Up to 400 m/min achievable in cutting, laser scoring and micro-perforation processes. The digital process enables immediate process changeover and a substantial reduction in time and costs (not possible in the case of “analogue” mechanical die cutters).
Printing, Packaging, Converting and Security RFID
European Equipment Supplier
Sold & Serviced by Matik, Inc.
Distributor in USA, Canada and Mexico
www.matik.com
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Post time: Oct-10-2017